International team reports powerful tool for studying, tuning atomically thin materials
Work could lead to heady applications in novel electronics and more.
Work could lead to heady applications in novel electronics and more.
Ranking at the top for the 12th year in a row, the Institute also places first in 11 subject areas.
The results could help turn up unconventional superconducting materials.
MIT engineers’ new technology can probe the neural circuits that influence hunger, mood, and a variety of diseases.
By adding weak linkers to a polymer network, chemists dramatically enhanced the material’s resistance to tearing.
A new Jell-O-like material could replace metals as electrical interfaces for pacemakers, cochlear implants, and other electronic implants.
A new material developed by MIT engineers exhibits “record-breaking” vapor absorption.
Through coursework, intercollegiate collaboration, and a site visit, MIT students fuse engineering and anthropology to propose innovative energy solutions.
The award will support a master’s degree in international relations, the next step in Khotimsky’s planned career in international energy negotiations or policy.
Unexpected experimental results often give Associate Professor Cem Tasan new insights into how metals break and deform — and how to design damage-resistant alloys.
A record-breaking number of presenters flock to the MIT event’s poster competition; topics range from synthetic mucus to nature-inspired design.
A study inspired by the Japanese paper-cutting art provides a blueprint for designing shape-shifting materials and devices.
Through the Multidisciplinary University Research Initiative, the US Department of Defense supports research projects in areas of critical importance to national defense.
A new method could provide detailed information about internal structures, voids, and cracks, based solely on data about exterior conditions.
A new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips.