Engineers produce smallest 3-D transistor yet
Process that modifies semiconductor material atom by atom could enable higher-performance electronics.
MIT Lincoln Laboratory wins 10 R&D 100 Awards
Technologies ranging from a hurricane-evacuation decision platform to algorithms that compare DNA samples honored as some of the world's best inventions of 2018.
Remembering Professor Emeritus Alan McWhorter, 1930-2018
Long-time EECS professor and Lincoln Laboratory division head is best known for research on transistors, lasers, and masers.
Study opens route to ultra-low-power microchips
Innovative approach to controlling magnetism could lead to next-generation memory and logic devices.
How to mass produce cell-sized robots
Technique from MIT could lead to tiny, self-powered devices for environmental, industrial, or medical monitoring.
Inexpensive chip-based device may transform spectrometry
Tiny device could replace expensive lab-scale equipment for many applications.
Fabrics are the future
Professor Yoel Fink is helping MIT lead the way in transforming the fabric materials in our lives.
Researchers quickly harvest 2-D materials, bringing them closer to commercialization
Efficient method for making single-atom-thick, wafer-scale materials opens up opportunities in flexible electronics.
Study opens route to flexible electronics made from exotic materials
Cost-effective method produces semiconducting films from materials that outperform silicon.
MIT researchers 3-D print colloidal crystals
Technique could be used to scale-up self-assembled materials for use as optical sensors, color displays, and light-guided electronics.
3Q: Muriel Médard on the world-altering rise of 5G
“The reason 5G is so different is that what exactly it will look like is still up in the air. Everyone agrees the phrase is a bit of a catch-all.”
MIT engineers build smart power outlet
Design can “learn” to identify plugged-in appliances, distinguish dangerous electrical spikes from benign ones.
Novel transmitter protects wireless data from hackers
Device uses ultrafast “frequency hopping” and data encryption to protect signals from being intercepted and jammed.
Integrating optical components into existing chip designs
Technique would allow addition of optical communication components to existing chips with little modification of their designs.
Engineers turn plastic insulator into heat conductor
Technique could prevent overheating of laptops, mobile phones, and other electronics.