Engineers mix and match materials to make new stretchy electronics
Next-generation devices made with new “peel and stack” method may include electronic chips worn on the skin.
A new facet for germanium
MIT researchers grow perfectly shaped germanium tunnels on silicon oxide with controllable length.
Powering the planet
Fikile Brushett and his team are designing electrochemical technology to secure the planet’s energy future.
MIT graduate students lead conference on microsystems and nanotechnology
Student committee puts together research showcase while balancing coursework, qualifying exams, and extracurriculars.
How to verify that quantum chips are computing correctly
A new method determines whether circuits are accurately executing complex operations that classical computers can’t tackle.
MIT researchers realize “ideal” kagome metal electronic structure
Newly synthesized compound of iron and tin atoms in 1-to-1 ratio displays unique behavior.
Restructuring the MIT Department of Electrical Engineering and Computer Science
The Institute's largest academic department reorganizes with new leadership as part of the formation of the MIT Schwarzman College of Computing.
Toward more efficient computing, with magnetic waves
Circuit design offers a path to “spintronic” devices that use little electricity and generate practically no heat.
Smart systems for semiconductor manufacturing
Lam Research Tech Symposium, co-hosted by MIT.nano and Microsystems Technology Lab, explores challenges, opportunities for the future of the industry.
Nature can help solve optimization problems
A low-cost analog circuit based on synchronizing oscillators could scale up quickly and cheaply to beat out digital computers.
“Electroadhesive” stamp picks up and puts down microscopic structures
New technique could enable assembly of circuit boards and displays with more minute components.
SMART develops a way to commercially manufacture integrated silicon III-V chips
New method from MIT’s research enterprise in Singapore paves the way for improved optoelectronic and 5G devices.
Quantum sensing on a chip
Researchers integrate diamond-based sensing components onto a chip to enable low-cost, high-performance quantum hardware.
Engineers develop multimaterial fiber “ink” for 3-D-printed devices
Filaments with embedded circuitry can be used to print complex shapes for biomedical and robotic devices.
MIT engineers build advanced microprocessor out of carbon nanotubes
New approach harnesses the same fabrication processes used for silicon chips, offers key advance toward next-generation computers.